Internet of Things

Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.

Over the last three to four years, the driverless robotaxi industry has begun to flourish. Driverless services are coming online in multiple cities across the US and China. IDTechEx's recent report, "Future Automotive Technologies 2024-2034: Applications, Megatrends, Forecasts", predicts that the driverless robotaxi industry will be generating over US$470 billion annually through services in 2034.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

Thursday 11 April 2024 - An overview of key printed and flexible sensor technologies and printed sensor material requirements? A critical evaluation of historic printed sensor market successes and shortcomings? Evolving and emerging trends and commercial use cases of printed and flexible sensors? Market opportunities and market forecast overview?

Sensors are vital in modern life. They measure a vast quantity of metrics and parameters, acting as the interface between the physical and digital worlds. Printed sensors can be produced in large areas on flexible substrates, reducing costs and unlocking new market opportunities. The new IDTechEx report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets", breaks down key trends by technology approach - highlighting both opportunities and challenges for the industry forecast to reach US$960 million by 2034.

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

IDTechEx's new report, "Future Automotive Technologies 2024-2034: Applications, Megatrends, Forecasts", highlights the biggest changes coming to cars over the next ten years. Electrification will change what powers cars, and automation will change how they are driven, but one of the biggest opportunities is connectivity and software definition, which will change how cars are monetized.

Artificial Intelligence is transforming the world as we know it; from the success of DeepMind over Go world champion Lee Sedol in 2016 to the robust predictive abilities of OpenAI's ChatGPT, the complexity of AI training algorithms is growing at a startlingly fast pace, where the amount of compute necessary to run newly-developed training algorithms appears to be doubling roughly every four months.

Tuesday 30 January 2024 - An overview of the megatrends changing the automotive industry; Explanation of what hardware/services are associated with each trend; CAGR growth rates for each of these technologies; Hardware vs services, where the biggest opportunity is