5G

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

The signing of the Stockholm Convention on Persistent Organic Pollutants (POPs) in 2001 marked a historic moment, as it was the first global treaty aimed at eliminating or restricting chemicals harmful to human and environmental health. The addition of perfluorooctanesulfonic acid (PFOS) to the Convention in 2009 marked yet another milestone, as PFOS and its related substances became the first of the PFAS family to be regulated on an international level

Thursday 2 May 2024 - Forever Chemicals: Insights into Regulations Affecting PFAS and Potential Alternatives; The definition and scope of PFAS; Concerns about the effects of PFAS exposure; Regulatory frameworks impacting PFAS worldwide; Emerging applications utilizing PFAS; Potential alternatives for PFAS in selected emerging applications

3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

IDTechEx Research announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials, and applications of electronics added to 3D surfaces, in-mold electronics (IME), and fully printed 3D electronics.

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.

Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

"Forever chemicals", or PFAS, are coming under increasing regulatory pressure globally as concerns over the negative effects of PFAS on human health and the environment are mounting. In their brand new report, "Per- and Polyfluoroalkyl Substances (PFAS) 2024: Emerging Applications, Alternatives, Regulations", IDTechEx dives deeply to explore the future trajectory of PFAS in five key emerging applications: thermal management for data centers, sustainable food packaging, electric vehicles, low-loss materials for 5G, and the hydrogen economy.